Quantenna Partners with Mimosa to Exclusively Power its Next Generation
Internet Access Solution
Quantenna to serve as the exclusive provider of 802.11ac wave 2 wireless technology to power Mimosa’s multiple outdoor wireless products
LAS VEGAS – January 6, 2014 -- Quantenna Communications, Inc., a leader in ultra-reliable Wi-Fi networking for whole-home entertainment, and Mimosa Networks, Inc., an innovator in next generation Internet access, announced today a collaboration in which Quantenna will be the exclusive provider of 802.11ac wave 2 technology to power Mimosa’s cutting-edge unlicensed wireless hardware suite. Additionally, Mimosa will partner with Quantenna in the joint development of enhanced physical layer and link layer technologies.
Scheduled for launch in 2014, Mimosa will integrate 802.11ac, featuring wave 2 multi-user MIMO technology, into multiple outdoor wireless products, overcoming prior Wi-Fi technology limitations via improvements in throughput and client capacity. The resulting products bridge the gap between fiber and Internet users, thus opening the industry to new service provider opportunities.
“The next great frontier in wireless technology is the ability to transmit independent streams to multiple clients simultaneously. With constantly increasing Internet demands, wireless hardware must leverage these innovations to leap forward in speed and client capacity,” Mimosa CEO, Brian Hinman, commented. “We are pleased to partner with such an innovative and forward-thinking chip company. Quantenna’s development efforts focus on using wider channels, more streams and multi-user MIMO to address the next phase of network demand, making their chipsets a perfect fit for the Mimosa product suite.”
Quantenna CEO, Dr. Sam Heidari, says of the collaboration, “Mimosa is an ideal partner for Quantenna. Mimosa has an unwavering focus on developing fiber-quality wireless products and exploiting all the benefits that 802.11ac Wave 2 has to offer. Quantenna will continue to stay at the forefront of Wi-Fi technology and looks forward to a long and mutually beneficial partnership with Mimosa.”
The Quantenna and Mimosa partnership provides unique value to the wireless market via innovative chip technology and the collaboration of top engineers in Silicon Valley for the creation of breakthrough wireless technology and hardware.
To set up a time to meet with Quantenna during CES, please contact quantenna@lewispr.com.
About Mimosa Networks, Inc.
Mimosa, an innovator in next generation Internet access, exploits the most advanced Wi-Fi technology to design and manufacture outdoor gigabit wireless platforms for service providers demanding fiber speed networks. Mimosa technology provides the highest level of scale, capacity and reliability for multiple verticals and applications. Founded in Silicon Valley in 2012, the company is led by Brian Hinman, notable CEO and founder of 2Wire, Polycom and PictureTel, and includes experienced executives and key talent from leading telecommunications and consumer product companies including Broadcom, Microsoft, MediaTek, and Ubiquiti. For additional information on Mimosa, please visit www.mimosa.co.
About Quantenna Communications, Inc.
Quantenna is a leading developer of 802.11ac and 802.11n Wi-Fi semiconductor solutions that deliver the performance, speed and reliability of wired Ethernet for multimedia data anywhere in the home. Quantenna pioneered the delivery of seamless video over Wi-Fi and set the performance standard for delivering wire-like quality HD video reliably throughout the connected home, for which it has amassed a list of major awards, including being named a “Top 5 Start-Up for 2013” by The Wall Street Journal. Founded in 2006, Quantenna has shipped millions of its Wi-Fi chipsets being deployed by major telco, cable and satellite service providers and operators worldwide including AT&T;, Bell Canada, Swisscom, Telefonica, France Telecom and Belgacom. Quantenna is headquartered in Silicon Valley, with offices worldwide. For additional information, visit www.quantenna.com.